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IM69D120 high performance digital xensiv tm mems microphone description the IM69D120 is designed for applications where low self-noise (high snr), wide dynamic range, low distortions and a high acoustic overload point is required. infineon's dual backplate mems technology is based on a miniaturized symmetrical microphone design, similar as utilized in studio condenser microphones, and results in high linearity of the output signal within a dynamic range of 95db. the microphone distortion does not exceed 1% even at sound pressure levels of 118dbspl. the flat frequency response ( 28hz low-frequency roll-of) and tight manufacturing tolerance result in close phase matching of the microphones, which is important for multi-microphone (array) applications. with its low equivalent noise floor of 25dbspl (snr 69db(a)) the microphone is no longer the limiting factor in the audio signal chain and enables higher performance of voice recognition algorithms. the digital microphone asic contains an extremely low-noise preamplifier and a high-performance sigma-delta adc. diferent power modes can be selected in order to suit specific current consumption requirements. each IM69D120 microphone is calibrated with an advanced infineon calibration algorithm, resulting in small sensitivity tolerances ( 1db). the phase response is tightly matched ( 2) between microphones, in order to support beamforming applications. features ? dynamic range of 95db - signal to noise ratio of 69db(a) snr - <1% total harmonic distortions up to 118dbspl - acoustic overload point at 120dbspl ? sensitivity ( 1db) and phase ( 2 @1khz) matched ? flat frequency response with low frequency roll of at 28hz ? very fast analog to digital conversion speed (6s latency @1khz ? power optimized modes determined by pdm clock frequency ? package dimensions: 4mm x 3mm x 1.2mm ? pdm output ? omnidirectional pickup pattern typical applications ? devices with voice user interface (vui) - smart speakers - home automation - iot devices ? active noise cancellation (anc) headphones and earphones ? high quality audio capturing - conference systems - cameras and camcorders ? industrial or home monitoring with audio pattern detection datasheet please read the important notice and warnings at the end of this document 1.0 www.infineon.com 2017-12-20
use cases ? below 1% total harmonic distortion - voice command during music from the loud speaker - efective active noise cancellation even close to loud noise source - recordings in a discotheque or at a rock concert ? high signal to noise ratio - far field audio signal pick-up - low volume audio and whispered voice capturing - microphone noise is no longer limiting the audio chain ? sensitivity and phase matching - full utilization of voice algorithms capability - audio beam forming - high and precise attenuation of background noise ? power optimized modes - low current consumption for always on applications - long operating time of battery powered devices block diagram digital signal processing voltage regulators power mode detector 1-bit pdm interface calibration coefficients digital core v dd ground data select clock amp mems bias charge pump adc mems backplate 1 backplate 2 membrane asic figure 1 IM69D120 block diagram product validation technology qualified for industrial applications. ready for validation in industrial applications according to the relevant tests of iec 60747 and 60749 or alternatively jedec47/20/22. IM69D120 high performance digital xensiv tm mems microphone use cases datasheet 2 1.0 2017-12-20
table of contents description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 typical applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 use cases . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 product validation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1 typical performance characterstics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 2 acoustic characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1 free field frequency response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 3 electrical parameters and characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 3.1 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.2 electrical parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.3 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4 typical stereo application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5 reliability specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 6 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 7 footprint and stencil recommendation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 8 packing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 IM69D120 high performance digital xensiv tm mems microphone table of contents datasheet 3 1.0 2017-12-20
1 typical performance characterstics test conditions: v dd = 1.8v, f clk = 3.072mhz, no load on data figure 2 typical freefield frequency response figure 3 typical thd vs spl figure 4 typical phase response vs frequency figure 5 typical group delay vs frequency figure 6 typical i dd vs v dd figure 7 typical noise floor (unweighted) IM69D120 high performance digital xensiv tm mems microphone typical performance characterstics datasheet 4 1.0 2017-12-20
2 acoustic characteristics test conditions ( unless otherwise specified in the table): v dd = 1.8v, f clk = 3.072mhz, t a = 25c, 55% r.h., audio bandwidth 20hz to 20khz, select pin grounded, no load on data, t edge = 9ns table 1 im69d130 acoustic specifications parameter symbol values unit note or test condition min. typ. max. sensitivity -27 -26 -25 dbfs 1khz, 94 dbspl, all operating modes acoustic overload point aop 120 dbspl thd = 10%, all operating modes signal to noise ratio f clock =3.072mhz snr 69 db(a) a-weighted f clock =2.4mhz 68 f clock =1.536mhz 66 f clock =768khz 64 20hz to 8khz bandwidth, a-weighted noise floor f clock =3.072mhz -95 dbfs(a) a-weighted f clock =2.4mhz -94 f clock =1.536mhz -92 f clock =768khz -90 20hz to 8khz bandwidth, a-weighted total harmonic distortion 94dbspl thd 0.5 % measuring 2nd to 5th harmonics; 1khz, all operating modes 118dbspl 1.0 119dbspl 2.0 120dbspl 10.0 low frequency cutof point f c lp 28 hz -3db point relative to 1khz group delay 250hz 70 s 600hz 15 1khz 6 4khz 1 phase response 75hz 19 1khz 2 3khz -1 directivity omnidirectional pickup pattern polarity positive pressure increases density of 1's, negative pressure decreases density of 1's in data output IM69D120 high performance digital xensiv tm mems microphone acoustic characteristics datasheet 5 1.0 2017-12-20
2.1 free field frequency response figure 8 IM69D120 free field frequency response table 2 IM69D120 free field frequency response, normalized to 1khz sensitivity value frequency (hz) upper limit (db) lower limit (db) 25 -2 -5 60 +0.5 -1.5 800 +1 -1 1000 0 0 1200 +1 -1 6000 +1 -2 8000 +4 -2 15000 +9 -2 IM69D120 high performance digital xensiv tm mems microphone acoustic characteristics datasheet 6 1.0 2017-12-20
3 electrical parameters and characteristics 3.1 absolute maximum ratings stresses at or above the listed maximum ratings may afect device reliability or cause permanent device damage. functional device operation at these conditions is not guaranteed. table 3 absolute maximum ratings parameter symbol values unit note / test condition min. max. voltage on any pin v max 4 v storage temperature t s -40 125 c ambient temperature t a -40 70 c v dd >3.0v -40 100 c 3.2 electrical parameters table 4 electrical parameters and digital interface input parameter symbol values unit note / test condition min. typ. max. supply voltage v dd 1.62 3.6 v a 100nf bypass capacitor should be placed close to the microphone's vdd pin to ensure best snr performance clock frequency range operating modes f clock 2.9 3.072 3.3 mhz 2.1 2.4 2.65 1.05 1.536 1.9 400 768 950 khz standby mode 250 data = high-z v dd ramp-up time 50 ms time until v dd v dd_min pdm clock frequency f clock 0.4 3.3 mhz clock duty cycle 40 60 % f clock <2.65mhz 48 52 % f clock 2.9mhz clock rise/fall time 13 ns input logic low level v il -0.3 0.35xv dd v input logic high level v ih 0.65xv dd v dd +0.3 v output load capacitance on data c load 200 pf IM69D120 high performance digital xensiv tm mems microphone electrical parameters and characteristics datasheet 7 1.0 2017-12-20
3.3 electrical characteristics test conditions (unless otherwise specified in the table): v dd = 1.8v, t a =25c, 55% r.h. table 5 general electrical characteristics parameter symbol values unit note / test condition min. typ. max. current consumption f clock =3.072mhz i dd 980 1300 a no load on data f clock =2.4mhz 800 1050 f clock =1.536mhz 620 800 f clock =768khz 300 380 standby mode i standby 25 50 clock of mode i clock_of 1 clock pulled low short circuit current 1 20 ma grounded data pin power supply rejection psr 1k_nm -80 dbfs 100mv pp sine wave on v dd swept from 200hz to 20khz psr 217_nm -86 dbfs(a) 100mv rms , 217hz square wave on v dd . a- weighted startup time 0.5db sensitivity accuracy 20 ms time to start up in all operating modes afer v dd_min and clock have been applied 0.2db sensitivity accuracy 50 mode switch time 0.5db sensitivity accuracy 20 ms time to switch between operating modes. v dd remains on during the mode switch 0.2db sensitivity accuracy 50 hysteresis width v hys 0.1xv dd 0.29xv dd v output logic low level v ol 0.3xv dd v i out = 2ma output logic high level v oh 0.7xv dd i out = 2ma delay time for data driven t dd 40 80 ns delay time from clock edge (0.5xv dd ) to data driven delay time for data high-z 1) t hz 5 30 ns delay time from clock edge (0.5xv dd ) to data high impedance state 1 t hold is depended on c load IM69D120 high performance digital xensiv tm mems microphone electrical parameters and characteristics datasheet 8 1.0 2017-12-20
table 5 general electrical characteristics (continued) parameter symbol values unit note / test condition min. typ. max. delay time for data valid 2) t dv 100 ns delay time from clock edge (0.5xv dd ) to data valid (<0.3xv dd or >0.7xv dd ) figure 9 timing diagram 2 load on data: c load =100pf, r load =100k? IM69D120 high performance digital xensiv tm mems microphone electrical parameters and characteristics datasheet 9 1.0 2017-12-20
4 typical stereo application circuit vdd r term r term c vdd c vdd clk data codec mic 1 mic 2 vdd vdd gnd gnd clk clk data data lr lr figure 10 IM69D120 stereo mode configuration note : for best performance it is strongly recommended to place a 100nf (c vdd_typical ) capacitor between v dd and ground. the capacitor should be placed as close to v dd as possible. a termination resistor(r term ) of about 100? may be added to reduce the ringing and overshoot on the output signal. IM69D120 high performance digital xensiv tm mems microphone typical stereo application circuit datasheet 10 1.0 2017-12-20
5 reliability specifications the microphone sensitivity afer stress must deviate by no more than 3db from the initial value. table 6 reliability tests test test condition standard vibration 20hz to 2000hz with a peak acceleration of 20g in x, y, and z for 4 minutes each, total 4 cycles mil-std-883j high temperature storage t a =+125c, 1000 hours jesd22 a-103e low temperature storage t a =-40c, 1000 hours jesd22-a119a high temperature operation t a =+125c, vdd=2.5v, 1000 hours jesd22 a-108d cold temperature operation t a =-40c, vdd=3.2v, 1000 hours jesd22 a-108d temperature/humidity bias t a =+85c, r.h = 85%, vdd=3.2v, 1000 hours jesd22-a101d mechanical shock 10000g/0.1msec direction x,y,z, 5 shocks in each direction, 30 shocks in total iec 60068-2-27 thermal cycle 1000 cycles, -40c to +125c, 30 minutes per cycle jesd22.a104e reflow solder 3 reflow cycles, peak temperature = +260c ipc-jedec j-std-020d-01 esd-slt 3 contact discharges of 8kv to lid while v dd and f clock are supplied according to the operational modes; (v dd and f clock ground is separated from earth ground) iec-61000-4-2 esd-hbm 1 pulse of 2kv between all i/o pin combinations js001 latch up trigger current from 150ma jesd 78e IM69D120 high performance digital xensiv tm mems microphone reliability specifications datasheet 11 1.0 2017-12-20
6 package information 0.850 0.700 0.300 0.300 1.320 0.700 1.500 2.000 1.200 0.850 1.200 0.1 0.250 0.04 3.000 0.1 4.000 0.1 all dimensions in mm 0.600 thru 0.400 1 2 3 5 4 xxxxxx pin 1 2-d barcode top view side view bottom view type code date code (yw) figure 11 IM69D120 package drawing table 7 IM69D120 pin configuration pin number name description 1 data pdm data output 2 v dd power supply 3 clock pdm clock input 4 select pdm lef/right select 5 gnd ground IM69D120 high performance digital xensiv tm mems microphone package information datasheet 12 1.0 2017-12-20
7 footprint and stencil recommendation the acoustic port hole diameter in the pcb should be larger than the acoustic port hole diameter of the mems microphone to ensure optimal performance. a pcb sound port size of radius 0.4 mm (diameter 0.8mm) is recommended. the board pad and stencil aperture recommendations shown in figure 12 are based on solder mask defined (smd) pads. the specific design rules of the board manufacturer should be considered for individual design optimizations or adaptations. figure 12 IM69D120 footprint and stencil recommendation note : dimensions are in millimeters unless otherwise specified IM69D120 high performance digital xensiv tm mems microphone footprint and stencil recommendation datasheet 13 1.0 2017-12-20
8 packing for shipping and assembly the infineon microphones are packed in product specific tape-and-reel carriers. a detailed drawing of the carrier can be seen in figure 13 figure 13 IM69D120 tape dimensions note : for further information about packing, please confer the packing document which is available on the infineon technologies web page or contact your local sales, application, or quality engineer. IM69D120 high performance digital xensiv tm mems microphone packing datasheet 14 1.0 2017-12-20
revision history document version date of release description of changes 1.0 20.12.2017 initial datasheet IM69D120 high performance digital xensiv tm mems microphone revision history datasheet 15 1.0 2017-12-20
trademarks all referenced product or service names and trademarks are the property of their respective owners. edition 2017-12-20 published by infineon technologies ag 81726 munich, germany ? 2017 infineon technologies ag all rights reserved. do you have a question about any aspect of this document? email: erratum@infineon.com document reference ifx-tgc1507128354827 important notice the information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (beschafenheitsgarantie) . with respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, infineon technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. in addition, any information given in this document is subject to customers compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customers products and any use of the product of infineon technologies in customers applications. the data contained in this document is exclusively intended for technically trained staf. it is the responsibility of customers technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. warnings due to technical requirements products may contain dangerous substances. for information on the types in question please contact your nearest infineon technologies ofice. except as otherwise explicitly approved by infineon technologies in a written document signed by authorized representatives of infineon technologies, infineon technologies products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury

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